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Title : AUSA 2019: Logos Technologies unveils its new airborne Multi-Modal Sensor Pod
link : AUSA 2019: Logos Technologies unveils its new airborne Multi-Modal Sensor Pod

AUSA 2019: Logos Technologies unveils its new airborne Multi-Modal Sensor Pod

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PlasLogos Technologies exhibits for the very first time at AUSA 2019, the Association of United States Army defense exhibition, its airborne, platform-flexible Multi-Modal Sensor Pod (MMSP).

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The Multi-Modal Sensor Pod combines wide-area, hyperspectral, and high-resolution sensors into a single podded system, with real-time onboard processing and storage. (Picture source Army Recognition)

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